Scintil Photonics raises funds to advance silicon photonic IC production
Scintil Photonics has secured €13.5M ($14.4M) in second round funding to industrialize silicon photonic IC production, led by Robert Bosch Venture Capital (RBVC), with historic shareholders Supernova Invest, Innovacom and Bpifrance, through its Digital Venture fund, reinvesting to bring the company’s total funding to €17.5M ($18.8M), to date.
Scintil Photonics aims to significantly enhance traditional high-speed system and chip interconnections. Its Augmented Silicon Photonic IC product is a single-chip consisting of active and passive components, all made entirely from standard silicon photonics processes available at CMOS commercial foundries, and where III-V optical amplifiers and lasers are integrated on the backside of advanced silicon photonic circuits. This unique all-in-one integration of amplifiers and lasers enables ultrahigh-speed communications, due to extensive parallelization and higher bit rates, e.g., from 800 to 3200 Gbit/s with very compact chips.
A fabless company, Scintil Photonics will use the funds to take its photonic IC industrialization program to the next level and speed up the global commercialization of its products that boost communications in data centers, High-Performance Computing (HPC) and 5G networks. Scintil Photonics’ products are unique in providing optical communication applications with higher bit rates, and scalable, cost-effective and mass-producible photonic ICs. This enables the multi-billion USD electronics industry to overcome the end of Moore’s Law with the integration of very high-speed optical communications.
“This demonstrates the major progress we have made over the past three years in taking our disruptive photonic IC technology to the fast-growing market segments of optical interconnects in 5G, Cloud HPC and datacom,” said Sylvie Menezo, president and CEO of Scintil Photonics.
“Scintil Photonics’ monolithic integration of III-V Lasers into silicon photonic chips is a key enabler for next-generation telecom, datacom and sensing,” says Ingo Ramesohl, managing director at RBVC. “The CMOS-compatible photonic IC process allows for higher design freedom, lower losses and a smaller footprint at low cost. Scintil Photonics uniquely unlocks further miniaturization and integration of photonic integrated circuits.”
“We have supported Scintil since its inception and believe that the company’s capability to integrate lasers in advanced silicon photonics is second to none currently on offer for the industry,” said Marion Aubry, investment director of the Bpifrance Digital Venture team.
www.scintil-photonics.com
www.rbvc.com
www.Bpifrance.fr
www.innovacom.com
www.supernovainvest.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
