Sima says next MLSoC will ‘transform’ AI at the edge
Sima Technologies Inc. (San Jose, Calif.) has said its second-generation MLSoC AI chip is coming in 1Q25 and will be manufactured on TSMC’s 6nm manufacturing process.
Sima claims that its second-generation MLSoC will provide a single software-centric platform for all edge AI applications and cover computer vision, transformer algorithms and up multimodal generative AI. This will enable better AI on robots, cars and drones, the company reckons.
To enable the introduction Sima has raised an additional US$70 million funding in a round led by Maverick Capital. This brings the amount raised by Sima since its foundation in 2018 to US$270 million.
The company said it would use the money to continue to meet demand for its first-generation MLSoC and work towards the release of its second-generation MLSoC in 1Q25. The first-generation MLSoC started shipping in August 2022 and is made for Sima in a 16nm FinFET process (see AI startup Sima starts shipping MLSoC chip, platform).
“AI – particularly the rapid rise of generative AI – is fundamentally reshaping the way that humans and machines work together. Our customers are poised to benefit from giving sight, sound and speech to their edge devices, which is exactly what our next generation MLSoC is designed to do,” said Krishna Rangasayee, founder and CEO at Sima, in a statement.
The second-generation MLSoC includes a Cortex-A series CPU from Arm and Synopsys EV74 embedded vision processors which enable critical pre-and-post processing in computer vision applications on a single chip.
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