Single-chip Balun for sub-1-GHz radio
New Products
|
By
eeNews Europe
The 3.26 mm2 single-chip balun replaces a conventional network of 16 discrete capacitors and inductors that can occupy up to 100 mm2 of board real-estate, a footprint reduction of more than 96%.
In addition to saving space, circuit design is greatly simplified, with no need to select component values or tackle exacting layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance. The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1- x 1.55-mm chip-scale package.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
