Single-package SSDs with 64-Layer 3D flash memory, from Toshiba

Single-package SSDs with 64-Layer 3D flash memory, from Toshiba

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By eeNews Europe

The BG3 series are BGA solid state drive (SSD) products based on Toshiba’s latest 64 layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH. Toshiba says the BG3 SSDs deliver better performance in terms of faster sequential read/write transfer speeds and a smaller footprint than traditional SATA-based drives. With its cost-effective DRAM-less design, the BG3 series enables a high quality user experience at a fraction of the power requirement of other NVM Express (NVMe) SSDs.


Toshiba’s BG3 series uses the Host Memory Buffer (HMB) feature in NVMe Revision 1.2.1 to maintain high performance without integrated DRAM by using host memory for flash management purposes. This combination allows devices to harness the performance of NVMe storage while maximizing footprint and affordability to deliver a next-generation mobile experience to end users. Both fast and economical, these miniaturized SSDs also offer data centre and enterprise applications an alternative solution for server boot storage. By eliminating DRAM from its design, Toshiba’s BG3 series claims the thinnest-available SSDs at 1.3mm high and delivers lower power consumption to maximize battery life.


Featuring a PCI Express (PCIe) Gen3 x2 lane and NVMe Revision 1.2.1 architecture, BG3 delivers to up to 1520 MB/sec sequential read, 2.7 times the theoretical maximum bandwidth of SATA 6 Gbit/sec and up to 840 MB/sec sequential write, 1.5 times the theoretical maximum bandwidth of SATA 6 Gbit/sec. Additionally, BG3 also features SLC cache for performance to accelerate burst type workloads, such as those routinely experienced on Windows-based PCs.


The ultra-compact BG3 series is available in 128 GB, 256 GB, and 512 GB capacities. All three models are available in a surface-mount BGA (M.2 1620) or a removable module (M.2 2230) form factor for platform design flexibility.


Toshiba Electronics Europe;







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