SiP and MCM pick and place machine offers high repeatability
This avoids a common problem in semicon back end; cracked components due to uncontrolled placement processes. New, and for the semicon industry exclusive features on the A-Series platform of Assembléon are the fluxer dip station and high accuracy cameras. Both items support a qualitative placement process for typical back end applications. The A-Series Hybrid can bond flip chips at a repeatability of 10 micron while placing at a record speed of 2,500 components per hour (cph) per single placement head. Die bonding speeds are 3,500 cph per head at 25 micron, while passives are placed at 8,000 cph at 40 micron. That is including the fluxing action. The first A-Series Hybrid model on the market can carry up to three specialized Twin Placement Robots (TPR), holding two heads per robot for a total flip chip bonding speed of 15,000 placements per hour per machine. Next to solely TPRs, the A-Series Hybrid can also carry conventional placement robots for chip shooting for passives as small as 01005 (0402M metric coding). In fact, the machine can be configured with any combination of robots for passives or dies towards the needs per specific application.
The A-Series Hybrid is programmed with various closed loop processes to control the picking and placing of components like dies. During the controlled linear robot movement, it continuously monitors the position of the parts before placing them with the Programmable Placement Force Control feature which can be as low as 0.5 Newton. 100% undamaged components are assured by the total elimination of impact forces, controlled by the advanced board collision detection mechanism. This all results in the industry’s highest first-pass-yield of over 99.99%, claims the company, eliminating waste, rework and defective end products.
Visit Assembléon at www.assembleon.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
