SiPearl partners with Samsung for built-in HBM in Rhea
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SiPearl, the company building the high-performance low-power European microprocessor for High Performance Computing (HPC) and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a leader in advanced memory technology, to equip its Rhea series with advanced High-Bandwidth Memory (HBM) technology, ideal for HPC and AI applications.
After an extensive market survey, SiPearl has selected Samsung, and its HBM for its outstanding speed and energy-efficiency combined with a reduced thermal resistance.
This collaboration will enable SiPearl to leverage Rhea family best-in-class performance and energy-efficiency for HPC and AI inference workloads.
“We are contributing to the expansion of SiPearl’s unique supercomputer/AI ecosystem with Samsung’s advanced HBM technology,” said Yongcheol Bae, Executive Vice President and Head of Memory Product Planning at Samsung Electronics. “As the HPC and AI market grows and diverse requirements increase, high-performance, high-bandwidth, low-power solutions are key to support development of the Rhea series in the future. We are committed to delivering memory that can bring superior performance and efficiency for future HPC and AI applications in a close collaboration with SiPearl.”
“At SiPearl, the partnership marks the emergence of a European pioneer in the use of HBM technology in conjunction with Samsung Electronics. Combining our high-performance, low-power microprocessor technologies with built-in HBM is key to meet all the requirements of supercomputing and AI inference workloads. On the fast-growing AI inference market, we think that our product will be a market leading solution for inference Large Language Model (LLM) tasks providing among other things high flexibility to model changes relative to options currently in use,” concluded Philippe Notton, CEO and founder of SiPearl.
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