The facility will become the foundation for advanced packaging technology services business and is based on a public-private partnership between SkyWater, Osceola County, Florida and the current operator BRIDG.


It was not stated how much money would be spent ramping up manufacturing capacity at Kissimmee or how quickly it would be spent.


BRIDG is the non-profit organization created to focus on advanced research, development, and manufacturing for next generation microelectronics while creating technology-based jobs in Florida. SkyWater said it will support BRIDG with multiple DoD contracts.


SkyWater will utilize the 109,000 square foot facility, with approximately 36,000 square feet of cleanroom space, to address commercial and government agency needs for US-sourced electronics.  The packaging facility is a natural complement to SkyWater’s 200mm wafer fab in Bloomington, Minneapolis.


SkyWater operates as a US ‘Trusted Foundry’ and bringing packaging on-shore provides the US process R&D, wafer fabrication and advanced packaging technology services within a domestic supply chain.


SkyWater notes that advanced packaging was included in the scope of the recently enacted National Defense Authorization Act (NDAA) which proposes billions of dollars of financial incentives in support of domestic semiconductor development and manufacturing. Advanced packaging includes 2.5D and 3D system-in-package methods and the heterogeneous chiplet-style of manufacturing that is expected to bring power consumption and form-factor advantages of traditional monolithic packaging.

“Through the partnership of SkyWater and BRIDG, the Center for NeoVation will immediately serve as an epicenter for reshoring advanced packaging capabilities while also driving the realization of state of the art heterogenous integration solutions,” said Brad Ferguson, CTO of SkyWater, in a statement.

“Our vision is to establish another SkyWater center of excellence in the US that will broaden the company’s ability to serve as a ‘one-stop shop’ for process innovation, wafer fabrication and advanced packaging,” said Thomas Sonderman, CEO of SkyWater, in the same statement.

Related links and articles:

News articles:

SkyWater to ‘on-shore’ packaging of chips in Florida

Carbon nanotube FETs ready to compete with silicon, say SkyWater, MIT

Globalfoundries, SkyWater sign deal to strengthen US chip supply

Fabless power startup teams with SkyWater

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