SMA Tx/Rx housings up to 25% more compact

SMA Tx/Rx housings up to 25% more compact

New Products |
By eeNews Europe

The High Density SMA (HDSMA) is designed to be edge-to-edge stackable while offering enhanced board density, and the Vertical SMA (VSMA) offers an even smaller PCB footprint for applications where devices are used singly on a PCB.

The HDSMA housing has PCB footprint of 10x7mm, offering a potential increase in device density over the traditional SMA (H22) PCB mount housing of between 22 and 50 percent depending on the amount of board edge available. The package was designed for systems requiring multiple Tx/Rx channels per PCB and features an all-metal, bolt-down design. OMC’s full range of fibre-optic emitter and receiver diodes can be supplied aligned and mounted in the new HDSMA receptacle. The VSMA) package has a PCB footprint of only 8x7mm which OMC believe makes it the world’s smallest PCB footprint SMA fibre-optic housing. With a modern, slimline design and all-metal body, the VSMA device bolts in place with a single screw and features a locating lip which slots into a groove in the PCB edge to securely fix the device in place. The VSMA package is designed to allow a fibre-optic transmitter or receiver to be incorporated into a PCB design while occupying the minimum possible PCB space. It is available with a wide range of visible and infrared emitters and fibre-optic receivers aligned and mounted within. The new housings still permit the use of a standard SMA connector with secure hexagonal locking nut.


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