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Smaller HEV power modules deliver higher power density

Smaller HEV power modules deliver higher power density

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By Christoph Hammerschmidt



When electrifying existing car platforms, space constraints are a significant challenge. As the inverter has to be placed in the typically cramped engine department, it has to be as small as possible. Inverter size is mainly defined by the power modules employed.

Consequently, these have to become smaller while at the same time providing sufficient power to actuate the electric drivetrain. The size of a power module, on the other hand, is defined by the power consumption of the power chips used inside, and the ability to cool these chips to stay below a maximum junction temperature.

At 15 nH, the stray inductance is very low while blocking voltage has been increased to 700 V. Both factors support the development of inverter systems with reduced switching losses by about 25% and very high efficiency. Thanks to the integrated isolation, the module can be directly attached to a cooler without external isolation thus simplifying system integration.

Each integrated IGBT chip is equipped with an on-chip current sensor for overcurrent protection. In addition, an on-chip temperature sensor provides derating and fast shut-off in case of over-temperature. The direct and precise sensing improves system monitoring. It also helps to simplify the functional safety architecture of automotive system suppliers and car manufacturers.

By combining double sided chip cooling with electrical isolation of the heat sinks, the thermal resistance RthJC of the HybridPACK DSC is significantly reduced to 0.1 Kelvin/Watt (K/W). In comparison, today’s power module HybridPACK 1 has a thermal resistance of 0.12 K/W. The HybridPACK DSC module technology also improves the electrical performance.

Stray inductance is one major parameter, defined by module size and the careful routing of the current path through the module. The HybridPACK DSC value of 15 nH is about 40% lower compared to reference modules.

The first member of the HybridPACK DSC family is the FF400R07A01E3_S6 implementing ICnom of 400A and VCES of 700V in half-bridge configuration. Engineering samples will be available in September 2016. A further product in the family implementing ICnom of 200A and VCES of 700V in a full-bridge configuration will be offered as engineering samples in October 2016. Further variants featuring different power ranges are under development.

Infineon; www.infineon.com/hybrid

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