Smaller outline for 22uF to 220uF tantalum chips; 2.0×1.2mm
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By
eeNews Europe
These miniaturised components offer the highest capacitance values (22 µF to 220 µF) available in both a standard 2012 (2.0×1.2 mm) and 3216 (3.2×1.6 mm) EIA case size with maximum package heights of as low as 1.0 mm, claims the manufacturer. In addition to offering a small footprint and low profile, advancements in counter-electrode technology and package design have resulted in the lowest ESR values available in the industry for these package sizes. These devices are suited for decoupling and filtering in DC/DC converters to reduce voltage drop in ultrabooks, as well as audio circuits and power management of IC-s in tablets and smart phones. These series complement KEMET’s T528 capacitors.
Kemet; www.kemet.com
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