Smart Packaging Solutions adds dual interface certified banking card based on ST’s solution
This platform is now qualified by SPS, and can be delivered to card manufacturers, enabling them to benefit from the EBooster technology.
With this addition, thanks to SPS EBooster technology and modular approach, smart card manufacturers are given a full set of options: they can select between major semi-conductor vendors, and choose native, JavaCard or Multos based operating systems. This way, smart card manufacturers are able to adapt easily to the complexity of market demand and ensure they are able to deliver banking cards fitting all financial institutions requirements.
SPS EBooster technology allows smart card manufacturers of all sizes to deliver reduced-cost high-performance dual technology cards to financial institutions issuing banking cards. SPS platform consists in a micro-module with contacts for EMV contact transactions integrating a small antenna, and an inlay with a full card size antenna, coupled with the small antenna, allowing an efficient communication in contactless mode between the card and the reader. This way, and because there is no physical connection between both antennas, cards are highly reliable, and even allow five lines of embossing in the ISO-defined area.
Thanks to the EBooster technology, smart card vendors are able to deliver dual technology contact & contactless cards without costly investments in their production line. They can easily integrate a stable process that guarantees high yield rates and reduced unit manufacturing costs for their dual interface card embedding process.
Visit Smart Packaging Solutions at www.s-p-s.com
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