SMIC forms center for vision, sensors, MEMS, 3D
SMIC makes ICs at critical geometries between 0.35-micron and 40nm at several wafer fabs in mainland China processing wafers of 200mm and 300mm diameter. Over the past few years, SMIC has been developing silicon manufacturing process technologies for MEMS, 3DIC, back-side illuminated CMOS image sensors and and through-silicon vias to to meet customers’ needs in mobile computing and smart device markets. So far it has one customer in production using CVS3D technology. SMIC did not name the customer or the technology but said it has customers with multiple CVS3D products in qualification.
"Going forward, the core concepts and fabrication methodology of 3DIC are clear drivers for advancing design, fabrication and system packaging technology of future imaging and other functional sensor devices," said Shiuh-Wuu Lee, SMIC’s executive vice president of technology development, in a statement. "In sharing this enlightening vision with its partners and customers, SMIC’s CVS3D is devoted to driving innovative technology to help our customers successfully realize their designs."
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