Chinese foundry Semiconductor Manufacturing International Corp. (SMIC) is planning to spend US$7.5 billon on a 300mm-diameter wafer fab in Tianjin in the north of China.
SMIC has announced entered into a partnership with Tianjin Xiqing Economic Development Group Co. Ltd. and other local authorities to build a fab to address technology nodes from 28nm to 180nm mainly for communications, automotive electronics applications. When completed the fab will be capable of running up to 100,000 wafer starts per month.
So far SMIC has committed to acquiring land for the fab but it is not stated when the fab is expected to begin production. SMIC manufacturing capacity utilization is reportedly running at 97 percent but it has three 300mm wafer factories under construction in Shanghai, Beijing, and Shenzhen. The Shenzhen factory is expected to be completed by the end of 2022. The Beijing factory is expected to begin operation in 2024.
A year ago SMIC announced plans for a 300mm wafer fab in Shanghai (see SMIC plans for $9 billion Shanghai wafer fab). That too iss expected to have a production capacity of 100,000 wafer starts per month and expects to avoid US sanctions by focusing on 28nm and earlier nodes. No indication was given of the time line for the construction and commissioning of that wafer fab.
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