SMT 20-circuit interconnect solution targets 25Gbit/s data and telecom

New Products |
By eeNews Europe

The zSFP+ connectors feature a preferential coupling design using insert moulding and a narrow edge-coupled blanked and formed contact geometry for optimised signal, mechanical and electrical performance while greatly reducing resonance compared to current SFP+ products. Components of the new zSFP+ interconnect system include: zSFP+ SMT 20-circuit connectors, stacked integrated connectors and passive optical cable assemblies. The zSFP+ SMT 20-circuit connector features the same PCB footprint, mating interface and EMI cage dimensions for total backward compatibility as a drop-in replacement for current SFP+ form factor host board designs.

The high-temperature thermoplastic housing can withstand lead-free processing. Single-port and 1x ganged cages support multiple port count applications and options for use with various board thicknesses and assembly processes to accommodate server and switch applications at a cost comparable to SFP+ cages. Ganged cages are available with two, four or six ports for multiple design options. The stacked integrated connector and cage is available in a press-fit application that eliminates reflow assembly and offers a compact, space saving design with ease-of-processing. An internal vertical shield provides unparalleled EMI reduction performance. Press-fit tails accommodate belly-to-belly applications for single and ganged cages to maximize use of printed circuit board (PCB) space. Optional rear and side-mounted light pipe cover assemblies allow flexibility of PCB signal routing of LEDs to provide port status and activity feedback to the user.

More information at

Visit Molex at


Linked Articles
eeNews Europe