Snap feature turns MikroE Click boards into a System on Module
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MikroElektronika is re-designing its Click boards to make them more suitable for production as a system on module.
The MikroE Click boards are used for prototyping and development, and the company has redesigned the boards to snap off the active components.
Click Snap allows engineers to develop their systems in the usual way using the add-on peripheral boards and development boards equipped with the mikroBUS socket. When the concept has been proven and code developed, the part of the board with the specific active peripheral circuitry – anything from sensors and communication modules to advanced audio processing and motor control – can be snapped free of the rest of the Click board and used as a System-on-Module (SoM).
The company has experience with SoM designs having developed the SiBrain format for microcontrollers, its Necto development tool and embedded Wiki with AI-generated code.
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The company has developed over 1500 Click boards and the first part to be made available with the Snap feature is Inclinometer 4 Click. This Click board measures angles of slope or elevation of an object using the FXLS8971CF 3-axis low-g MEMS accelerometer from NXP Semiconductor. This has selectable full-scale ranges of ±2/4/8/16g and features such as selectable output data rates, motion detection, and a 144-byte output data buffer. It is ideal for industrial and medical IoT applications, including asset tracking, equipment monitoring, smart metering, and orientation detection.
“Click boards are ideal for fast, low cost embedded systems development, saving many hours of duplicated, wasted effort, and eliminating costly development tools. But when you need to take the next step, from initial proof-of-concept prototyping to fully functional design, space, weight and power consumption may become an issue,” said Neb Matic, CEO of MikroE which manufactures the Click boards in Belgrade, Serbia.
“By breaking out the ‘Snap’ section of our new Click Snap boards, designers can have immediate access to parts that have been proven in their design, but which are only marginally larger than the active chip on its own. Weight and power consumption will also be significantly reduced. They can use this for final prototyping or low volume production.”
The Snap feature also allows the active part of the add-on board to be situated remotely from the development board, connected to the microbus carrier board via a flexible cable. This could be potentially very useful for sensing systems development, for example.
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