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Soitec, UMC team for first 3D RF-SOI chips

Soitec, UMC team for first 3D RF-SOI chips

Business news |
By Nick Flaherty

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French substrate developer Soitec is working with UMC on the industry’s first 3D IC solution for Radio Frequency Silicon-on-Insulator (RF-SOI) technology for 5G and millimetre wave designs.  

UMC’s 3D IC technology for RF-SOI uses engineered wafers from Soitec to incorporate more RF front-end modules in a single device by vertically stacking dies with wafer-to-wafer bonding.

This 3D RF-SOI approach reduces die size by more than 45%, enabling designers to integrate more RF components to address the greater bandwidth requirements of 5G, including new spectrum for mmWave bands.

The Soitec RF-SOI substrates provide the mechanical and electrical performance needed to ensure large volume manufacturing of UMC’s solution with no degradation of RF performance and UMC in Taiwan has been working with these since 2013.

“We are very proud of our longstanding partnership with UMC, which now extends to the industry‘s first 3D IC for RF-SOI. The combined experience and expertise of UMC and Soitec places us in a strong position to drive innovation to meet the future challenges of energy- and volume-efficient RF Front Ends. By extending the domain of RF-SOI solutions to 3D integration, future smartphones will accommodate new frequency bands envisioned for the 5G-Advance and 6G era, while making room for new features to come. At the same time, future XR and other IoT devices will benefit from compact RF Front-Ends, delivering enhanced data rates while ensuring energy consumption efficiency,” said Jean-Marc Le Meil, Executive Vice President of the Mobile Communications Division of Soitec.  

“Soitec has been a key partner for UMC in driving advances in wireless communications over the years with their state-of-the-art engineered substrates. Leveraging our strong partnership with Soitec, UMC’s innovative 3D IC solution for RF-SOI has generated significant interest from customers as they seek to integrate more RF components in 5G-enabled wireless devices without compromising on form factor or performance. Going forward, we are excited to collaborate further with Soitec to target the 5G mmWave market and beyond,” said Raj Verma, Associate Vice President of Technology Development at UMC.

www.soitec.com; www.umc.com

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