Solderless system connects LED COB array holders rapidly
The customizable interconnects feature a low-profile harness interface that delivers power to the array through a simple and reliable connection to a holder, or plastic substrate. With a low overall package height of ~2.00 mm, Molex PSI provides a slim design for space-limited applications while minimizing substrate costs.
The PSI system is ideal for high-density and high-light output applications such as downlighting (track, pendants and linear) and area lighting (roadways, parking lots and wall packs). LED Chip-on-Board technology ensures strong future development capabilities by allowing integration of additional components.
The system supports a variety of potential PSI designs including:
- Circular: 22.50 by 22.50 mm COB size; 36.00 mm outer diameter and 2.0 mm height profile;
- Rectangular: 22.50 by 22.50 mm COB size; 36.50 by 28.50 mm outer dimension and 2.00 mm height profile;
- Customizable shapes, sizes, mounting hole patterns and interconnects.
The solderless Pico-EZmate harness attaches to the LED array holder with no special processes or tools for an efficient connection that minimizes contact with the array to reduce the risk of damage. The vertical snap-to-mate connection, positive-lock latching feature and gold plated contacts deliver superior reliability. The harnesses will be offered in three wire gauge configurations and various lengths for a range of initial harness options based on application need.
Related articles and links:
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
