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Sonical, XMOS team on Headphone 3.0 dongle

Sonical, XMOS team on Headphone 3.0 dongle

Business news |
By Nick Flaherty



UK microcontroller designer XMOS is working with Sonical on the US on a low latency wireless hearable dongle for live music systems.

The joint development between XMOS and Sonical focusses on a wireless dongle that streams Hi Res (24/96) uncompressed Linear audio from a PC to a headset or other playback device.

The wireless technology can be low power Bluetooth enabled (BLE) or ultra-wideband (UWB). In addition to precise reproduction of High Resolution audio at 24bit, 96Hz sampling Frequency, the UWB technology will also support latencies under 5 milliseconds for the These performance figures render the solution capable of addressing the very demanding Musical Instrument (MI) and Live Performance markets.

“The platform unlocks a wide range of new product experiences using a low latency wireless connection for premium audio devices. The DSP is a critical component as it makes products a lot more than “wireless DACs”. By making the device “Appable” through downloadable plugins, we have enabled limitless possibilities,” said Gary Spittle, CEO of Sonical.

“We are delighted to be working with Sonical on the development of their wireless (UWB/BLE) dongle,” said Aneet Chopra, EVP Marketing & Product Management at XMOS. “This will usher the next generation of audio experiences and use cases for various devices including headsets. The device benefits from the low latency multiple threads available with our xcore.ai platform, simplifying the integration of critical DSP functions with predictable hard real time execution. This is great for audio platforms like Sonical. We look forward to the roll-out of this innovative solution and seeing the broad range of subsequent applications.”

Early demonstrations can be arranged at CES in Las Vegas in January.

www.sonical.ai; www.xmos.com

 

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