Sony aims for lowest power IoT combo chipset

Sony aims for lowest power IoT combo chipset

New Products |
By Nick Flaherty

Sony Semiconductor Israel has launched a chipset for massive IoT networks with 5G, satellite and LPWAN connections that it says has the lowest power consumption.

The ALT1350 is the world’s first chipset to combine cellular LTE-M/NB-IoT with sub-GHz low power wide area network (LPWAN) communication protocols and satellite connectivity (NTN) as well as an AI-enabled sensor hub.

The standby mode (eDRX) in the chipset reduces power consumption by 80% when compared to the current generation and by 85% when used it to send short messages. Overall improvements in the system’s power management enable four times longer battery life for a typical device, enabling additional functions with smaller batteries.

The iSIM-based chipset supports the mature Release 15 LTE-M/NB-IoT software stack, and future compatibility with 3GPP release 17 to guarantee longevity and operation with 5G networks.

A sub-GHz and 2.4GHz integrated transceiver enables hybrid connectivity for smart meters, smart cities, trackers, and other devices. The supports IEEE 802.15.4-based protocols such as Wi-Sun, U-Bus Air, and wM-Bus, in additional point-to-point and mesh technologies. It supports the IPv4/IPv6 internet protocols with TCP/UDP, PPP, FTP, HTTTP, TLS, HTTPS and SSL as well as DTSL, MQTT, CoAP and LWM2M.

The ALT1350 also incorporates a sensor hub based on an ARM Cortex-M0+ core to collect data from the sensors while maintaining ultra-low power consumption. It also provides cellular & Wi-Fi-based positioning and is tightly integrated to provide power-optimized concurrent LTE and GNSS to accommodate various tracking applications, which can be demanding, with a single chip.

The chipset provides edge processing capabilities with data collection and low-power AI/ML processing of the data using an ARM Cortex-M4 integrated controller with 1MB NVRAM and 752KB RAM to run the IoT applications.

The ALT1350 also includes a secure element for application usage and integrated SIM (iSIM), designed for PP-0117 to meet GSMA requirements.

“The market demand for this multiprotocol, ultra-low power IoT chipset is intensifying, and Sony’s ALT1350 chipset meets that demand,” said Nohik Semel, CEO at Sony Semiconductor Israel. “This is the game changer we’ve been waiting for, which will enable IoT deployments, utilizing universal connectivity on edge processing and multiple location technologies.”

The chipset in a single package, although Sony has not specified the size, and is sampling to lead customers and will become commercially available during 2023.


If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News


Linked Articles