Source down in a DFN 5×6 package
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eeNews Europe
Offering a very low package resistance and inductance, the AOE66410 is well suited in telecommunications applications for secondary rectification, in half bridge configuration for BLDC motor applications, and battery management where paralleling is important. The AOE66410 has the same form factor of a standard DFN 5×6 package but the Source pad has the largest connection to the PCB. This will enable power supply designers to parallel devices more easily and have a larger thermal area to dissipate any losses. The package has a 1mOhms maximum resistance at 10Vgs with a maximum drain current of 100A at 25°C case temperature.
Alpha and Omega Semiconductor – www.aosmd.com
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