Space-saving Schottky rectifiers in chip scale packages

Space-saving Schottky rectifiers in chip scale packages

New Products |
By Jean-Pierre Joosting

Diodes Incorporated has announced the introduction of a series of high-current Schottky rectifiers in ultra-compact chip scale packages (CSPs). The DIODES™ SDM5U45EP3 (5-A, 45-V), DIODES™ SDM4A40EP3 (4-A, 40-V), and DIODES™ SDT4U40EP3 (4-A, 40-V) achieve the industry’s highest current densities in their class, addressing market demands for smaller and more powerful electronic systems.

Each device can be employed for a variety of different purposes, serving as blocking or reverse-polarity protection diodes, electrical over-stress protection diodes, and free-wheeling diodes. The rectifiers in this series are designed for use in space-constrained applications — such as portable, mobile, and wearable devices, as well as IoT hardware.

Leading the trio, the SDT4U40EP3 is the industry’s smallest 4-A trench Schottky rectifier, being the first ever in a 1608 package. It takes 90 percent less PCB area than competing devices. Its 800 A/cm2 current density, also the highest for a trench Schottky in the industry, is due to its patent-pending innovative cathode design and manufacturing processes. The resulting ultra-low forward voltage performance (0.47 V typical) minimizes power losses, enabling the design of higher efficiency systems. Furthermore, its superior avalanche capability makes it robust enough to deal with extreme operating conditions, including transient voltages.

The X3-TSN1616-2 packaged SDM5U45EP3 has a 2 mm2 footprint, while the 1.28 mm2 footprint of the X3-TSN1608-2 packaged SDM4A40EP3 and SDT4U40EP3 enable system designers to maximize board real estate in modern, highly integrated consumer products. These ultra-thin CSPs, with their 0.25 mm (typical) profiles, have shortened thermal paths, resulting in greater power dissipation, reducing thermal BOM costs and increasing reliability.

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