Spatial atomic conformal layer deposition targets flexible electronics
The aim is to develop the materials and processes needed to bring spatial ALD to market-readiness in new application domains such as organic photovoltaics (OPVs), OLED lighting and displays. The spatial ALD group builds on 4 years of expertise within TNO, which has already resulted in the creation of a spin-off company.
ALD is a technique capable of producing ultra-thin conformal films with atomic level control over thickness. It is widely accepted in, for example, the semiconductor industry. Spatial ALD is an approach that combines high throughput with low cost.
It’s an ALD mode where the reactions are separated spatially instead of through the use of purge steps. This allows high deposition rate and high throughput at atmospheric pressure, without compromising the typical ALD assets. The tool development has already led to the creation of a spin-off equipment manufacturer called SoLayTec. On the process side, one of the milestones has been the demonstration of Al2O3 layers with deposition rates compatible with high industrial throughput demands (10 – 100 times faster than conventional ALD).
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