Speedstack PCB layer stackup design system, in new language versions
With the system; accurate PCB stackup data can be shared between OEM designers and PCB fabricators in the local language of key markets; working with Germany, Japan and China is simplified; stackup documentation can be exported in a range of industry-standard formats, for fast optimisation of PCB costs and manufacturing yields; and users can achieve consistent communication throughout the supply chain.
Polar Instruments adds, “One of the key strengths of the Speedstack system is its ability to accurately document detailed specifications for each layer in a PCB stackup. Providing OEM designers and PCB fabricators with the ability to share these specifications in their local language further enhances the speed and ease of using the Speedstack system for PCB stackup design.”
Speedstack is already licensed with OEM designers, PCB technologists and PCB fabricators worldwide, providing a fast process for creating and accurately documenting stackups for High-Density Interconnect (HDI) and flex-rigid PCBs. The system also allows PCB fabricators to fine-tune the stackup design by assessing the impact of different PCB materials on cost, performance and manufacturing yield. The accurate stackup data generated by Speedstack can be exported in different industry-standard formats and shared with companies throughout the PCB supply-chain.
Polar Instruments; www.polarinstruments.com
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