Spring probes improve first pass yields for PCBA testing
In volume manufacturing the impact worsens as cycle count increases and elevated levels of debris are transferred to the probe tips. In many applications effective electrical contact is compromised.
Lead free solder is known to cause many problems during in-circuit testing. Lead free solder has a higher reflow temperature, which can result in harder and stickier solder flux resin and a thicker, harder oxide layer. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Lead free solder resin and oxides can also increase debris transfer to spring probes.
ECT’s EDGE probes meet the challenges as well as those found in OSP (organic solderability preservatives) and no-clean applications by combining innovative probe design with the ultra-hard plating material – ECT’s proprietary LFRE hard plating. LFRE plating is harder than the industry’s standard gold plating. LFRE has a hardness range of 550 to 650 Knoop. LFRE improves tip performance while helping maintain tip sharpness.
EDGE probes feature an ultra sharp tip geometry that is capable of penetrating debris, oxide and OSP layers. The tip radius is 0.0003 inch and is about 10 times sharper than typical machined probe tips. Additionally, EDGE probes apply ECT’s proven Micro-Wipe bias technique that provides low and consistent internal contact resistance.