ST announces general-purpose MPUs for high temperatures
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STMicroelectronics has announced the mass-market availability of new STM32MP23 general-purpose microprocessors (MPUs), which combine high-temperature operation up to 125°C with the speed and efficiency of dual Arm® Cortex®-A35 cores.
The MPUs provide superior performance and ruggedness for industrial and Internet-of-Things (IoT) edge computing, advanced HMI, and machine-learning applications. Joining the STM32MP25 series launched in 2024, the new MPUs feature dual 1.5 GHz Arm Cortex-A35 cores, a 400 MHz Cortex-M33 for real-time applications, and a neural network accelerator with 0.6 TOPS performance. Additionally, there is a 3D graphics processor, H.264 decoder, MIPI CSI-2 camera interface with raw data support, dual Gigabit Ethernet ports with time-sensitive networking (TSN), and two CAN-FD interfaces.
The STM32MP23 MPUs integrate various processing resources and optimised features to enhance sensing, processing, and data handling in smart factories, cities, and homes. A neural engine facilitates AI and machine learning for intuitive HMIs, vision-based interactions, and predictive maintenance. The H.264 decoder enables 1080p60 video, while the 3D GPU delivers real-time graphics that support frameworks such as OpenGL, OpenCL, and Vulkan.
Addressing connected applications, the STM32MP23 series targets SESIP3 (already achieved for STM32MP25 MPUs) and PSA Level 3 certifications. Protection features include secure boot, Arm TrustZone™ architecture, secure key storage, and tamper detection with hardware cryptographic accelerators.
ST is also extending support for each release of the OpenSTLinux distribution from two years to five years to enhance stability for customers throughout development and extend access to the latest security patches, easing compliance with the EU Cyber Resilience Act (CRA). The commitment to mainlining OpenSTLinux lets developers work comfortably with popular frameworks such as Yocto, Buildroot, OpenWRT, and OpenSTDroid.
Also available is the STM32MP257 discovery kit to start evaluating the STM32MP23x, coupled with the dedicated STM32 MPU embedded software running the STM32MP23x configuration.
BGA package options include a choice of high-density 0.5-mm and 0.8-mm interconnect pitch, which allows simplified 4-layer PCBs with plated-through holes. The packages are all pin-to-pin compatible with STM32MP25 MPUs and operate over a maximum junction temperature of -40°C to 125°C.
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