
ST deal boosts long term device availability
STMicroelectronics has signed a deal with Rochester electronics to support the long term supply of its devices.
The Rochester has a substantial bank of die that are end of life, and has the masks from semiconductor makers to make more. The deal will see active and end of life support for ST’s microprocessors as well as analog, mixed signal and discrete devices.
This is particularly important for extended product lifecycle management and safety inventory during times of constrained supply, says Rochester.
The company is a licensed semiconductor manufacturer that has made over 20,000 different types of older components. It has over 12 billion die in stock with the capability to manufacture over 70,000 device types. Manufacturing services including design, wafer processing, assembly, test, reliability, and IP archiving.
Related articles
- Industry mergers are driving semiconductor obsolescence
- Rochester takes on obsolete Atmel devices
- Rochester re-introduces Intel’s 8XC196 family
- Over 5m Intel chipset parts transferred to Rochester
- Product lifecycle management from design through maintenance
“Rochester is excited to announce our collaboration with STMicroelectronics, enhancing our position in the market by offering a broad range of highly reliable active and end-of-life products to our customers,” said Stephen Morris, general manager for Europe (EMEA) at Rochester Electronics.
“The collaboration with Rochester will enable us to enhance the service for our customers beyond the normal cycle of product availability,” said Frank Wolinski, EMEA Region VP Head of Channel Sales, STMicroelectronics.
Rochester Electronics has authorized lines of supply from over 70 leading semiconductor manufacturers with over 15 billion devices in stock encompassing more than 200,000-part numbers.
Other articles on eenews Europe
- World’s first trial of quantum security over hollow core fibre cable
- AIoT filter library is microcontroller agnostic
- Deal creates largest European foundry capacity for integrated photonic circuits
- Leti combines nine research tracks for sustainable electronics
- Machine learning boost for complex chip and package reliability analysis
- Return of smartphone manufacturing in Germany
- Galway in line for Intel megafab
