ST, eYs3d team up on 3D computer vision

ST, eYs3d team up on 3D computer vision

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By Peter Clarke

STMicroelectronics and fabless chip company eYs3D Microelectronics Co. Ltd. (Taipei, Taiwan) have teamed up on machine vision.

The two companies plan to demonstrate the results of their collaboration at CES 2023 in Las Vegas. These include a stereo video and depth camera made from active-code infrared technologies with improved feature recognition and autonomous guidance at mid-to-long working range.

The Ref-B6 and Ref-B3 ASV (Active Stereo Vision) video and depth cameras both combine the eYs3D computer vision processor and the eSP876 stereo 3D depth-map chipset with global shutter image sensors from ST than have enhanced near-infrared (NIR) sensitivity.

The embedded eYs3D chipset enhances object edge detection, optimizes depth de-noising, and outputs HD-quality 3D depth data up to 60 fps frame rate. The Ref-B6 stereo-video camera achieves a 6-centimeter baseline and 85deg(H) by 70deg(V) depth field of view.

“STMicroelectronics’ advanced image sensors, using proprietary process technologies, offer class-leading pixel size while offering both high sensitivity and low crosstalk,” said James Wang, chief strategy officer for eYs3D Microelectronics, in a statement issued by ST. “The strong connection we have established with ST increases our confidence to develop new products that will lead the machine vision market,” he added.

David Maucotel, business line manager for imaging at ST, said the collaboration could win business for ST in such sectors as robots, home and industrial automation, home appliances. “While the reference designs showcased at CES are using monochromatic sensors, we can already foresee exciting enhancements and further use-cases using the RGB and RGB-IR versions of our sensors,” he said.

Both eYs3D reference designs include a software development kit supporting Windows, Linux and Android OS environments with multiple different programming languages and wrapper APIs.

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