Stackable multi-row board-to-board connectors are solderless

Stackable multi-row board-to-board connectors are solderless

New Products |
By Jean-Pierre Joosting

Addressing the growing market demand for high-density interconnects in challenging automotive application scenarios, the latest ENNOVI-MB2B multi-row board-to-board (BTB) connector platform features a proprietary ‘snap-in biscuit’ design, allowing multiple connectors to be stacked together without solder.

The connectors offer a unique cost-effective approach that enables different pin count requirements to be accommodated via the same basic interconnect platform, without any extra expense or engineering effort.

The multi-row BTB connectors feature ENNOVI´s patented 0.4-mm miniPLX™ press-fit terminals made from a copper alloy that exhibits very low levels of contact resistance (<1 mΩ). Each pin has a 3-A current carrying capability. The optional coating of these pins with the company’s patented IndiCoat™ plating technology mitigates tin whisker build-up, this preventing the risk of short circuits and extending operational lifespan. 

ENNOVI-MB2B connectors are available in board stacking heights from 7-mm to 30-mm. They can have between 1 and 6 rows, with up to 30 contact terminals being incorporated into each row. Conforming with automotive performance requirements, these rugged products can withstand high humidity levels (8 hour cycling up to 10% RH), mechanical shock (35g for 5 to 10ms across 10 axes) and vibration (8 hour per axis). A working temperature range of -40°C to +150°C is supported.

“Being able to fit enough interconnect terminal pins into a small space, while not having any excess, is a priority for any of our clients. At the same time, keeping their total cost of ownership down is also vital,” explains Ralph Semmeling, Product Portfolio Director at ENNOVI. “This means that the companies we are dealing with want access to off-the-shelf products at attractive price points, but with the inherent flexibility that following a custom-based strategy offers. Our new ENNOVI-MB2B stackable interconnect platform gives them the best of both worlds. Allowing them to design at cost.” 

There are a broad variety of applications that the robust, high-density, scalable multi-row BTB connectors will be targeted at. Among the most prominent of these are going to be electric vehicles (EVs), particularly for Electric Power Steering (EPS) and Electronic Control Unit (ECU) functions.

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