Chipletz Inc. (Austin, Texas), a fabless substrate startup, has selected Siemens Digital Industries Software, previously known as Mentor Graphic, as an EDA partner for its products.
Chipletz was founded in 2021 by a number of senior executives from AMD and is developing a technology called Smart Substrate. By supporting die-to-die interconnect, I/O and multiple voltage domains within the substrate Chipletz wants to support the integration of almost any die from any manufacturer.
This will support artificial intelligence, high-performance computing and immersive consumer experiences, Chipletz claims. Chipletz has selected a suite of Siemens’ EDA tools for the design and verification of its Smart Substrate technology.
“The Chipletz vision is to revolutionize semiconductor in-package functionality through the development of advanced packaging technology that bridges the gap between the slowing of Moore’s Law and the rising demand for compute performance,” said Bryan Black, CEO of Chipletz, in a statement issued by Siemens. “Our Smart Substrate designs, now in development, are very demanding. Siemens has demonstrated that they have the ideal technology for our needs.”
To design and verify the heterogeneous integration of multiple ICs into a Smart Substrate based package, Chipletz selected Siemens’ Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx software and Calibre 3DSTACK software solutions.
Chipletz is targeting delivery of its initial products to its customers and partners in early 2023.