The company was founded by Professor Hanchen Huang of Northeastern University and two of his PhD students.
The "glue" works by the use of tiny angled nano-rods. One set is coated with indium and the other of gallium and where they meet the rods interlace. Where the indium and gallium meet they combine and form a liquid while the heat extraction from the metal rods turns back into a solid creating a strong sealed bond.
The glue provides the strength and the thermal and electrical conductance of a metal bond.
The metallic glue has many potential applications in the electronics industry including replacing interconnect soldering for electrical conductivity, for thermal conductivity such as heat sinks and for mechanical integrity where high temperature soldering is not possible due to risk of fire or explosion.
The metallic glue has the advantage over conventional polymer glues of functioning at high temperature and being resistant to leaks of air and gas that could weaken the bond over time.
The founders of the company have authored a paper in the January edition of Advanced Materials & Processes.
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