The round was led by Artiman Ventures and Robert Bosch Venture Capital and included Abies Ventures, Asahi Kasei Corporation, Hui Capital and Sony Innovation Fund.
This brings the amount raise by UltraSense since its founding in 2017 to $24 million. It is notable that Artiman was an investor in MEMS sensor company InvenSense, which was sold to TDK for $1.3 billion in 2016. UltraSense was founded by a former executive at InvenSense and recruited a number of former InvenSense executives to join him (see TDK agrees to pay $1.3 billion for InvenSense).
In a statement Amit Shah, partner of Artiman Ventures, said UltraSense had gained “traction” with multiple customers in several markets.
The company has introduced its first TouchPoint product – a MEMS device attached atop a 0.18-micron CMOS mixed-signal ASIC – in a component measuring 1.4mm by 2.4mm by 0.49mm.
The technology can simplify control surfaces and reduce the need for apertures in casings and housings. The initial application is likely to be 5G smartphones with vehicles as a next one.
“From automotive to consumer products, we look forward to helping disrupt the touch interface market,” said Gen Tsuchikawa, chief investment manager at Sony Innovation Fund.
“With a number of the top mobile OEMs in active evaluations and/or deployment of our technology, we expect to see products in the market later this year,” said Mo Maghsoudnia, founder and CEO, UltraSense Systems.
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