Startup TeraSignal offers optimizing re-driver IC for optical modules

Startup TeraSignal offers optimizing re-driver IC for optical modules

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By Peter Clarke

TeraSignal Inc. (Irvine, Calif.) has launched CMOS re-driver ICs for 800G linear pluggable optical (LPO) modules in the data center. The TS8401/02 reduce power by up to 50 percent and add link training and diagnostics.

The TS8401/02 chips are intelligent 400G (4x100G) PAM4 modulator drivers with digital link training and link monitoring for 800G linear pluggable optical (LPO) modules. The re-driver will increase power efficiency for AI deployments in data centers, TeraSigmal claims.

By leveraging the existing microcontroller (MCU) in the LPO module, the TS8401/02 automates essential adjustments and introduces link diagnostics and link accountability, transforming LPO modules into adaptive link optimization systems.

The TS8401/02 introduces such features as, including digital eye monitor for real-time link performance measurements and link training with host SerDes. The CMOS implementation reduces power consumption by as much as 50 percent compared to existing SiGe re-drivers.

“By incorporating intelligence within the re-driver, we have introduced a new class of AI-centric CMOS devices that offer DSP-like features with significantly lower power and the lowest possible latency, setting a new industry standard for high-speed interconnects,” said Armond Hairapetian, founder and CEO of TeraSignal.

TeraSignal is now shipping samples to early access customers and partners. The TS8401 features wire bond pads, while the TS8402 offers the same capabilities in a flip-chip version.

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First 800G DSP for linear receive optics in hyperscale and AI data centers

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