Stress-relieved high voltage X7R MLCC delivers 4x improvement in capacitance value
The company uses a patent-pending technique to produce a single multilayer chip which reduces electro-mechanical stresses in the body of the component, whereby a proprietary layer decouples mechanical stress across thick devices. This allows for consistent and reliable performance of thicker and larger size devices. The first parts to become available in the StackiCap family will be 1812 and 2220 case sizes, with 200V to 1.5kV and 200 to 2kV operating voltage ranges respectively. Claiming an industry first, Syfer’s 2220 500V device features 1µF capacitance in a single chip. The 2kV part also features an impressive 100nF capacitance previously found only in the much larger case sizes. Meanwhile, in the 1812 range, the 200V part also features 1µF capacitance, while the 1kV device features 180nF capacitance, previously only possible in larger size components.
In some instances, the parts will allow for a size reduction from 8060 to 2220, providing a factor of 10 saving in board space. In addition, designers will see further benefits, including reduced component count, and hence lower assembly costs. This range is fully compliant with the RoHS and is available now on a standard 6 week delivery for production volumes.
Visit Syfer Technology at www.syfer.com
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