Surface mount ceramic fuses eliminate dendrites

Surface mount ceramic fuses eliminate dendrites

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By Nick Flaherty

Dendrites form during the electro-deposition process, whereby heavy marks could appear on the fuse end caps or housing. A thorough inspection and cleaning is required according to MIL-PRF 23419. Adding lead to otherwise pure tin soldering is commonly used as a preventive measure.

To do without lead, Schurter has extended its SMD thin-film fuse family MGA with the aviation version, MGA-A, using gold instead of lead. Gold plated end caps provide a surface where neither whiskers nor dendrites can form. This makes the new MGA-A a safe solution for use in not only highly sensitive electronics in the aviation industry but often suffices for use in the industrial grade space sector. The device is hermetically sealed, ultra-robust and well suited for use in intrinsically safe applications according to ATEX and IECEx requirements. Despite its very small footprint (1206), the MGA-A has a particularly high breaking capacity of up to 300 A at 125 VDC and can be used in a wide temperature range of -55 °C to +125 °C.

Schurter AG –

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