The US-based Semiconductor Research Corp. has produced the Microelectronics and Advanced Packaging Technologies (MAPT) roadmap claiming it will be a guide for the era of 3D chips.
The declared aim for the MAPT Roadmap is to do for the 3D chip era what the International Technology Roadmap for Semiconductors (ITRS) did for era of 2D scaling of semiconductors. The report has been produced as an adjunct to the 2030 Decadal Plan for Semiconductors released by the SRC and Semiconductor Industry Association in January 2021 (see US should spend US$34 billion on chip R&D, says report).
The 212-page report is the result of a couple of years of effort by hundreds of individuals representing 112 organizations across government, academia and industry. It has energy efficiency, sustainability and workforce development as the underlying primary considerations.
The Decadal Plan identified five seismic shifts in the industry related to smart sensing, memory and storage, communication, security, and energy efficient computing. The MAPT Roadmap follows this up by outlining an implementation plan for the semiconductor industry.
Six areas of fundamental research are listed: advanced packaging, 3D integration, electronic design automation, nanoscale manufacturing, new materials, and energy-efficient computing. The MAPT Roadmap is framed around fundamental and practical limits of information and communications technology sustainability: energy sustainability, environmental sustainability, and workforce sustainability.
The last ITRS report was published in 2015. The SIA issued a statement at that time: “Faced with ever-evolving research needs and technology challenges, industry leaders have decided to conclude the ITRS and transition to new ways to advance semiconductor research and bring about the next generation of semiconductor innovations.”
The report attempts to do this across 11 chapters:
- Application drivers and system requirements
- Sustainability and energy efficiency
- Security and privacy
- Digital processing
- Analog and mixed-signal semiconductors
- Photonics and MEMS
- Advanced packaging and heterogeneous integration
- Materials, substrates, and supply chain
- Design, modeling, test, and standards
- Manufacturing and process development metrology
- Workforce development
Each chapter is substantial with detailed consideration of the current state of the art and trends and necessities into the next decade.
The full MAPT Roadmap can be downloaded from the links below.