
SweGaN in Sweden building a volume wafer plant for its high power gallium nitride on silicon carbide epitaxial wafers.
The company develops and manufactures custom-made GaN-on-SiC epitaxial wafers for IDMs and foundries, fabless chip companies and system manufacturers. The new plant will have a capacity of up to 40,000, 100 mm/150 mm, epi wafers per year and follows €12m raised in the Series A funding round last year. This is to provide volume production meet accelerated global demands for GaN-on-SiC epiwafers used in 5G base stations, defence radars, low-orbit satellite communications and power switches for EVs says the company.
- SweGaN raises €12m for GaN-on-SiC wafers
- 150mm GaN-on-SiC epiwafer boost for power chips
- GaN-on-SiC pushes RF and power performance
The new facility will be built at the Innovative Materials Arena (IMA), a tech cluster in Linköping, Sweden.
Completion of the project is planned for the end of Q2 with deployment of the company’s innovative manufacturing processes to produce next-generation GaN-on-SiC engineered epitaxial wafers in high volume.
“The new SweGaN HQ and production facility provides substantial flexibility and means to support the company’s expansion during its growth journey – in both capacity and space,” says Henrik Tölander, COO, SweGaN.
“This major step strengthens SweGaN’s deep roots in Sweden and will bring the entire company together under one roof,” he said “We also aim to create a stimulating and inspiring work environment for young talents, materials specialists, and all strategic roles alike to join our exciting growth journey and build the company with us.”
“A new order is being established for semiconductor supply chains, and we are striving to be a go-to strategic partner for our customers in this new era.” says Jr-Tai Chen, CEO, SweGaN. “Harnessing the challenges and opportunities associated with the new era of semiconductor manufacturing, SweGaN’s vision has become clearer than ever – to build a sustainable, smart and green manufacturing for the materials that can enhance connectivity, security, and mobility of the future.”
