
The SD-15901 FBGA design provides space and power savings with a 34% smaller footprint and 35% less power dissipation than the previous generation, enabling SWaP optimization of PCB layout and ease of assembly with ball grid array surface mounting.
Using coarse and fine digital angle inputs, the combiner provides up to 22-bit angle resolution, making it suitable for high-performance position control systems requiring real-time precision resolution. Additionally, the SD-15901 is RoHS compliant, and rated for the full military temperature range (-55°C to +125°C).
Data Device Corporation – www.ddc-web.com
