The multi-protocol architecture of the T5851 STM16G makes it suitable for testing all SSDs with ball grid arrays (BGA) or land grid arrays (LGA) in both engineering and high-volume production environments. Using one common platform reduces deployment risks along with modular upgradability and can test multi-protocol NAND devices with speeds up to 16 Gbit/s. The system’s tester-per-DUT architecture supports the test flows required for fast system-level-test with up to 768 devices in parallel.
Almost all NAND memory in smart phones are using high-speed serial protocol interface controllers such as PCIe and UFS, the majority of which will require system-level testing (SLT). In addition, shipments of UFS memories are expected to nearly triple in the next three years and surpass embedded multi-media cards (eMMC), the current market leader. By 2021, more than 800 million total eMMC, UFS and NAND smart phone units will be shipped, according to the market research firm IHS Markit.
The configuration and performance of the T5851 STM16G can be optimized for any generation of devices. Advantest’s FutureSuite software ensures that the new tester can be easily integrated with all other members of the T5800 product family. The tester can also be combined with Advantest’s M6242 automated component handler to create a turnkey test cell, it has a liquid-cooling system for reliable thermal management and higher reliability.
Shipments to customers are scheduled to begin in the second quarter of calendar 2019.