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Materials & processes Page 337

Materials & processes Page 337
High reliability 65-V GaN process is offered to RFMD’s foundry service customers
High reliability 65-V GaN process is offered to RFMD’s foundry service customers
Business news |
RF Micro Devices, Inc., has qualified its GaN1 power semiconductor process technology for 65 V operation. The high reliability power…
ESCATEC becomes design partner for Atmel touch sensing technology
ESCATEC becomes design partner for Atmel touch sensing technology
Business news |
Swiss-based EMS specialist, ESCATEC of has been appointed as one of the two Atmel Design Partners for touch sensing technology…
IBM researchers demo graphene IC on SiC wafer
IBM researchers demo graphene IC on SiC wafer
Technology News |
IBM Research unveiled the first integrated circuit fabricated from wafer-size graphene, and demonstrated a broadband frequency mixer operating at frequencies…
Betting on liquid TSV processes for 3D integration
Betting on liquid TSV processes for 3D integration
Interviews |
A 2001 spin-off from CEA-Saclay, ten-year old French company Alchimer has grown from a chemistry research lab to become the…

Austriamicrosystems releases new versions process design kit for 0.18-um high-voltage CMOS technology
Austriamicrosystems releases new versions process design kit for 0.18-um high-voltage CMOS technology
New Products |
Austriamicrosystems' Full Service Foundry has announced at the availability of two new analog/mixed signal high performance process design kits ("HIT-Kit") for its 0.18 µm High-Voltage CMOS technology H18. Jointly developed…
Japan ‘actual’ chip sales collapsed in April
Japan ‘actual’ chip sales collapsed in April
Market news |
Actual chip sales for the Japan region in April were the lowest for 23 months, according to figures from the World Semiconductor Trade Statistics (WSTS) organization. It is likely to…
Mentor Graphics introduces cable harness engineering suite
Mentor Graphics introduces cable harness engineering suite
Business news |
Recognizing the importance of cable harnesses as a pivotal component in today's cars and aircraft systems, design software vendor Mentor Graphics has significantly enhanced its Capital Harness software suite to…
Elpida, Powertech, UMC team on 3-D at 28-nm
Elpida, Powertech, UMC team on 3-D at 28-nm
Technology News |
Elpida Memory Inc., of Japan, Powertech Technology Inc., and United Microelectronics Corp., of Taiwan have announced that they have finalized a three-way collaboration to deliver 3-D IC integration technologies for…
European EMS firm broken in three
European EMS firm broken in three
Business news |
TES Electronics Solutions (Langon, France), an electronics design and manufacturing services company, is being broken up and sold off to three different companies by order of the Tribunal de Commerce…
IBM to test wafer pruning
IBM to test wafer pruning
Technology News |
A new wafer pruning technique could save 15 percent in semiconductor chip manufacturing costs and increase profits per chip by as much as 12 percent, according to the Semiconductor Research…
Fabbing graphene arrays rivaling silicon process
Fabbing graphene arrays rivaling silicon process
Technology News |
Purdue University researchers have advanced a manufacturing method for creating single-crystal arrays of graphene which is similar to the production of silicon wafers.
IMEC makes GaN-on-silicon
IMEC makes GaN-on-silicon
Technology News |
European research institute IMEC and its partners in a program on gallium-nitride fabrication have produced device quality GaN/AlGaN layers on 200-mm silicon wafers.
ZSW uses roll-to-roll system to deposit CIGS thin-film cells on a 25 micrometre thin polymer film
ZSW uses roll-to-roll system to deposit CIGS thin-film cells on a 25 micrometre thin polymer film
Technology News |
The Center for Solar Energy and Hydrogen Research Baden-Württemberg (ZSW) is claiming a breakthrough in the development of efficient web coating of thin-film solar modules made of copper indium gallium…
Gold remains strong in electronics with record demand in 2010
Gold remains strong in electronics with record demand in 2010
Market news |
According to the World Gold Council's figures, 2010 sets a new high for global gold demand in electronics at 326.8 tonnes, with increased use of gold in Chinese electronics manufacturing…
20nm dual Damascene structures plated with new copper chemistries
20nm dual Damascene structures plated with new copper chemistries
Technology News |
Atotech has partnered with the College of Nanoscale Science and Engineering (CNSE) in Albany, New York to develop, evaluate, qualify, and optimize copper chemistries used for plating advanced semiconductor devices.
Vapour phase solder support for process profiling
Vapour phase solder support for process profiling
New Products |
SolderStar 's newly developed system features a unique design to allow profiling of vapour phase soldering processes. The system is usable in both batch and inline machines, including those with…
New packaging technology replaces wire bonding to double the current density in power semiconductors
New packaging technology replaces wire bonding to double the current density in power semiconductors
Technology News |
Semikron has developed a revolutionary packaging technology for power semiconductors, which removes the need for bond wires, solders and thermal paste. The new SKiN technology is based on the use…
TSMC joins Sematech, cites 450-mm R&D
TSMC joins Sematech, cites 450-mm R&D
Business news |
Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced that it has decided to join Sematech, the international consortium of semiconductor manufacturers, as a core member.
Modular gang test system with integrated UUT power supply
Modular gang test system with integrated UUT power supply
New Products |
The SFX-TAP16/G is what Goepel Electronic launches as the worldwide first completely modular gang test system with integrated UUT power supply. Without any additional hardware, users are now able to…
Infineon purchases Qimonda’s manufacturing facilities for Euro 100.6 million
Infineon purchases Qimonda’s manufacturing facilities for Euro 100.6 million
Business news |
Infineon Technologies Dresden GmbH has purchased real estate and manufacturing facilities from the insolvency administrator managing the assets of Qimonda Dresden GmbH & Co. OHG, Dr. Michael Jaffé, for a…
Lab aims for superconducting FET
Lab aims for superconducting FET
Technology News |
The resistance of superconductivity to rational explanation has prompted the U.S. Department of Energy's (DoE) Brookhaven National Laboratory to fabricate atomically perfect ultra-thin-films capable of accurately characterize the transition from…
Infineon to invest Euro 198 million in Austria for production, research and development
Infineon to invest Euro 198 million in Austria for production, research and development
Business news |
As part of the investment volume planned for the 2011 fiscal year, Infineon Technologies is investing about Euro 198 million in production capacity expansion and in research and development in…
Intel tips 22-nm tri-gate, but mobile is MIA
Intel tips 22-nm tri-gate, but mobile is MIA
Technology News |
As expected, Intel Corp., rolled out its 22-nm process—with a twist. The chip giant introduced the process, based on its long-awaited 3-D transistor design, dubbed tri-gate. First disclosed by Intel…
Solvent-free conformal coating for PCBs
Solvent-free conformal coating for PCBs
New Products |
Addressing the demanding environmental and reliability requirements of modern printed circuit board (PCB) products, Henkel has formulated Hysol PC40-UMF, a solvent-free conformal coating material that offers excellent performance while delivering…
Design and assembly process guidelines for bottom termination components
Design and assembly process guidelines for bottom termination components
Technology News |
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and…
Research project aims at stacked multi-sensor systems
Research project aims at stacked multi-sensor systems
Technology News |
Development of complex miniaturized multi-sensor systems for automotive and industrial applications is the goal of the MANOS research project. Within the scope of the project, eight companies collaborate in driving…
TSMC spins out solar, LED units
TSMC spins out solar, LED units
Business news |
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) plans to transfer its solar and solid-state lighting businesses into two new subsidiaries.
India preps $5 billion two-fab plan
India preps $5 billion two-fab plan
Business news |
The Indian government has announced renewed efforts to try and create a chip manufacturing industry on the sub-continent and is looking for investment of about $5 billion to build two…


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