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Materials & processes Page 9

Materials & processes Page 9
France signs quantum technology deal with US
France signs quantum technology deal with US
Technology News |
The United States and France have signed a deal on quantum technology during the visit of president Emannuel Macron to…
Interview: Pandemic response drives Industry 4.0 at Limerick
Interview: Pandemic response drives Industry 4.0 at Limerick
Interviews |
Leo McHugh, vice president for industrial automation for Analog Devices, based in Limerick, Ireland, talks to Nick Flaherty about expanding…
China’s YMTC confirms lead in 3D NAND flash memory
China’s YMTC confirms lead in 3D NAND flash memory
Technology News |
Yangtze Memory Technologies Co. Ltd. (Wuhan, China), has produced and deployed a 232-layer NAND flash memory ahead of rivals, according…
ST deal for 200mm SiC production
ST deal for 200mm SiC production
Business news |
STMicroelectronics has extended its deal with French materials developer Soitec to start qualification of 200mm silicon carbide wafers for…

Top articles in November
Top articles in November
Feature articles |
The two most popular articles in November covered a wide range of topics, from a record efficiency for a silicon solar cell panel to Kontron’s Raspberry Pi4 programmable…
Miniature spectrometer suits wearable applications
Miniature spectrometer suits wearable applications
Technology News |
Researchers at the University of Michigan say they have developed a wafer-thin chip-scale spectrometer that is suitable for wearable applications.
Latvia moves to boost semiconductor manufacturing
Latvia moves to boost semiconductor manufacturing
Business news |
Twelve partners in Latvia have signed a Memorandum of Understanding (MoU) to develop semiconductor manufacturing and training in the country. There are three key strands to the memorandum: developing the…
Indoor farming AI startup boost from Dutch chemicals firm
Indoor farming AI startup boost from Dutch chemicals firm
Business news |
Dutch speciality chemicals giant Nouryon has invested in AgEye Technologies to support its automation platform for indoor farming. The platform uses artificial intelligence to turn visual inputs from cameras into…
Airbus, Renault join forces on battery technology
Airbus, Renault join forces on battery technology
Business news |
Transition to new battery chemistries in the focus…
Call for UK semiconductor strategy amid confusion
Call for UK semiconductor strategy amid confusion
Business news |
UK chip firms are pushing for the UK to publish its semiconductor strategy, with a call to support leading edge chip design as well as compound semiconductor manufacturing to tackle…
Silicon Catalyst expands chip startup support in UK
Silicon Catalyst expands chip startup support in UK
Business news |
Incubator Silicon Catalyst has added three key companies to its support network to help chip design startups get to market faster. The new In-Kind Partner (IKP) companies are all based…
Chinese startup MEMS, power foundry set to IPO
Chinese startup MEMS, power foundry set to IPO
Business news |
Foundry Semiconductor Manufacturing Electronics Shaoxing Corp. (SMEC) has received approval for an initial public offering of shares on the Shanghai Stock Exchange’s STAR Market. While IPOs have been cancelled or…
UK should back compound semis, says government report
UK should back compound semis, says government report
Business news |
A UK government committee has produced a report urging financial support for compound and advanced materials semiconductor R&D and manufacturing. The report makes the argument that compound semiconductors is one…
€2bn BMW battery plant for Hungary
€2bn BMW battery plant for Hungary
Business news |
BMW is building a high-voltage battery assembly in Hungary for its next generation of electric vehicles. Highlighting the need for battery assembly across Europe, the 140,000 m² plant is being…
OpenLight launches electronic and photonic PDK
OpenLight launches electronic and photonic PDK
New Products |
US spinout OpenLight has released its unified process design kit (PDK). This combines both electronic and photonic designs used at the foundry at Tower Semiconductor in Israel. The OpenLight PDK…
Marc Biron, Melexis: Chip shortages and the EU Chips Act
Marc Biron, Melexis: Chip shortages and the EU Chips Act
Interviews |
Belgian fabless chip maker Melexis has been at the heart of the chip shortage, and sees no sign of it stopping. “From an education point of view, semiconductors are the…
Leti, Intel look to quadruple hybrid bonding speeds
Leti, Intel look to quadruple hybrid bonding speeds
Technology News |
CEA-Leti in France has been working with Intel on a hybrid die-to-wafer process that could quadruple production speeds for chiplet-based packages. The process developed with Intel explores another approach for…
Infineon’s microcontrollers to go RRAM with TSMC
Infineon’s microcontrollers to go RRAM with TSMC
Technology News |
Infineon’s next generation Aurix microcontrollers will make use of resistive RAM (RRAM) embedded non-volatile memory instead of embedded flash. Foundry Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) is offering embedded…
European Chips Act amended, softened, approved
European Chips Act amended, softened, approved
Technology News |
Envoys from the member states of the European Union have agreed to an amended version of the €45 billion European Chips Act on Wednesday, according to Reuters. The European Chips…
GaN power semiconductor 2023 predictions
GaN power semiconductor 2023 predictions
Feature articles |
GaN Systems has made its predictions for 2023, covering the supply chain for power semiconductors to increasing sustainability regulations in data centres and electric vehicles. “We are at the inflection…
£484m as UK waits to join EU Horizon research programme
£484m as UK waits to join EU Horizon research programme
Technology News |
The UK government has announced £484m of funding for a number of research programmes that are struggling with the delay in joining the Horizon Europe programme. UK Research and Innovation…
Silicon Europe pressures EU on chip startups, training
Silicon Europe pressures EU on chip startups, training
News |
Silicon Europe, a group of chip and technology companies, is pressuring the EU to move faster with its support for the industry, particularly for training engineers and supporting the 10,000…
PragmatIC: Making semiconductor fabs more sustainable
PragmatIC: Making semiconductor fabs more sustainable
Interviews |
Making the world’s semiconductor fabs sustainable is a major challenge. Richard Price, chief technology officer of PragmatIC Semiconductor talks to Nick Flaherty about a project to do just that. UK-based…
Startup boost in €16.9bn European space agency funding
Startup boost in €16.9bn European space agency funding
Business news |
The European space programme will see a 17% increase in funding to €16.9bn after a key meeting in Paris today. The increase will see a new lunar lander, a new…
PA Consulting owner Jacobs sees space boost
PA Consulting owner Jacobs sees space boost
Business news |
US infrastructure giant Jacobs has seen 5.7% growth in 2022 The latest figures for the group, which owns 65% of UK tech firm PA Consulting, show $14.9bn turnover, up from…
Downturn, China see semiconductor capex slashed
Downturn, China see semiconductor capex slashed
Market news |
After a record year in 2022 with over $180bn of investment, the semiconductor equipment market is set to fall by 19% in 2023. Research by ICinsights is predicting the fall…
Intel’s foundry boss is set to move on
Intel’s foundry boss is set to move on
Business news |
Randhir Thakur, president of Intel’s foundry services division, is leaving the company to pursue other opportunities, according to reports The development of foundry services is a key part of CEO…
Nanowire technique prints flexible circuits on curved surfaces
Nanowire technique prints flexible circuits on curved surfaces
Technology News |
Researchers at North Carolina State University say they have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces.


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