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Solid-state micro battery in advanced packaging breakthrough
Solid-state micro battery in advanced packaging breakthrough
Business news |
Milestone paves the way for in-package energy storage using solid-state battery technology, enabling reliable, compact, and efficient SiP designs.
MPUs in SIP and SoC formats for advanced graphics and connectivity
MPUs in SIP and SoC formats for advanced graphics and connectivity
New Products |
SAMA7D65 MPU runs 1 GHz Arm® Cortex®-A7 core and integrates MIPI DSI®, LVDS display interfaces and 2D GPU for HMI…
First miniature SIP reed relay with 5 kV stand-off capability
First miniature SIP reed relay with 5 kV stand-off capability
New Products |
Device is by far the smallest SIP high voltage reed relay on the market with a 5 kV capability, at…
ARIES Embedded joins STMicroelectronics Partner Program
ARIES Embedded joins STMicroelectronics Partner Program
Business news |
STMicroelectronics Partner Program offers a large ecosystem that serves customers with optimized support and accelerates time-to-market.

OCP and JEDEC look to standardize chiplet part descriptions
OCP and JEDEC look to standardize chiplet part descriptions
Technology News |
Partnership establish a framework for the creation of new global standards for novel device components such as chiplets in emerging markets.
Choosing between ASIC, SoC and SiP technologies
Choosing between ASIC, SoC and SiP technologies
Feature articles |
As sensor technology advances, the ASIC, SoC and SiP are integral to getting extra functionality into a miniature device at reasonable cost.
PCB-less 3D magnetic sensor for vehicle safety and ADAS
PCB-less 3D magnetic sensor for vehicle safety and ADAS
New Products |
Robust 3D Hall-effect position sensor IC enables flexible integration for precision contactless position sensing.


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