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Tata’s Indian fab to produce silicon in 2026, say reports

Tata’s Indian fab to produce silicon in 2026, say reports

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By Peter Clarke



A Tata-Powerchip wafer fab, the first to be established in India for more than 30 years, is expected to be producing silicon in 2026, according to local reports quoting Ashwini Vaishnav, Minster of Railways, Communications and Electronics & Information Technology.

On Wednesday March 13 Indian Prime Minister Narendra Modi helped lay the foundation stones for the Tata-PSMC wafer fab in Dholera, Gujarat and for a Semiconductor Assembly and Test (OSAT) facility in Jagiroad, Morigaon, Assam. PM Modi did this by a virtual presence.

The two units are expected to include a 70 percent subsidized outlay by Tata Electronics Pvt. Ltd. of 1.18 trillion rupees (about US$14 billion) by Tata Electronics and to generate nearly 50,000 direct and indirect jobs (see Tata will get 70 percent subsidy for Gujurat fab, says PSMC chair).

Additionally, PM Modi inaugurated the CG Power-Renesas OSAT facility in Sanand, Gujarat (see Renesas teams for OSAT packaging plant in India).

The foundation laying ceremony in Dholera was attended by Minister Vaishnav, Natarajan Chandrasekaran, Tata Group chairman and Randhir Thakur, CEO of Tata Electronics Pvt. Ltd.

Speaking at the occasion Chandrasekaran, said, “Today, is indeed a special day for the Tata group – with the foundation stone being laid simultaneously for our projects in Dholera and Jagiroad 2,500 kilometers apart. These semiconductor manufacturing hubs will have a lasting impact on the entire nation.”

The Dholera fab is being developed in collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC) of Taiwan at cost of about 910 billion rupees (about US$11 billion) and is expected to create more than 20,000 direct and indirect skilled jobs.

With a manufacturing capacity of up to 50,000 wafers per month the fab is expected to provide power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic in support of automotive, computing and data storage, wireless communication and artificial intelligence applications.

Tata Electronics’ OSAT facility in Jagiroad, Assam is being developed at an investment outlay of 270 billion rupees (about US$3.25 billion) and is expected to create over 27,000 direct and indirect jobs. The facility will support wire-bond, flip-chip, and integrated systems packaging (ISP).

Related links and articles:

www.tata.com

www.powerchip.com

www.renesas.com

News articles:

Tata will get 70 percent subsidy for Gujurat fab, says PSMC chair

Renesas teams for OSAT packaging plant in India

Tata, Powerchip win OK for US$11 billion Indian wafer fab

Tata commits to semiconductor factory in Gujurat, India

Tower proposes US$8 billion Indian wafer fab, says report

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