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TDK, TI team on edge AI module with wireless mesh

TDK, TI team on edge AI module with wireless mesh

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By Nick Flaherty



TDK has teamed up with Texas Instruments on a compact, battery-powered wireless multi-sensor module that uses edge AI to detect anomalies in machinery and equipment.

The TDK i3 Micro Module integrates the TI SimpleLink CC2652R7 wireless chip, an ARM Cortex-M4F multiprotocol 2.4-GHz wireless 32-bit microcontroller (MCU) for real-time monitoring. The module also integrates TDK’s IIM-42352 MEMS accelerometer and digital output temperature sensor, edge AI, and mesh network functionality into a single unit, facilitating data aggregation, integration, and processing.

The i3 Micro Module allows users to achieve sensing at most any desired position without physical constraints such as wiring by using a wireless mesh to connect up the modules in the network. This helps identify anomalies in machinery and equipment, enabling Condition-based Monitoring (CbM).

The accelerometer features digital-output X-, Y-, and Z-axis accelerometer with programmable full-scale range of ±2g, ±4g, ±8g, and ±16g, user-programmable interrupts, I3C℠ / I²C / SPI slave host interface, digital-output temperature sensor, an external clock input that supports highly accurate clock input from 31 kHz to 50 kHz, and 20,000g shock tolerance.

Monitoring through real-time visualized empirical equipment data instead of relying on manpower and scheduled maintenance contributes to a a predictive maintenance system to minimize production downtime.

“As more electronics and automation are being implemented in factories and buildings, companies are seeking more efficient ways to anticipate and manage equipment needs, avoiding expensive downtime,” said Nick Smith, product marketing manager at Texas Instruments.

“This collaboration between TI and TDK will bring more technology into factories and increase their efficiency through simpler and more powerful sensing and real-time communication. TI’s connectivity technology is backed by over 20 years of experience to help drive innovations such as these modules.”

“TDK’s i3 Micro Module facilitates numerous benefits to the manufacturing floor to enable digital transformation and an enhanced smart factory environment,” stated Christian Hoffman, General Manager, Corporate Marketing Group at TDK. “The module simplifies the deployment and sensor data gathering process giving users the bandwidth to focus on effective condition based monitoring and predictive maintenance initiatives.”

The i3 Micro Module is expected to be available through most global distribution partners by the fourth quarter of 2023.

www.tdk.com/en/featured_stories/entry_046-sensor-micro-module.html

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