Unlike other IP companies, CEVA says, it has always built silicon with its own IP as proving vehicles; this chip has been fabbed for it by SMIC in a 55-nm process. It contains a TeakLite-4 DSP core plus a wide assortment of peripheral and connectivity option. In the development platform it comes on a PCB with a Zynq (Xilinx) SoC that provides CPU (ARM core) and user-FPGA space. Developers will be able to, “streamline development of low-power ‘smart and connected’ devices,” CEAV says.
The company is careful to state that this is strictly a development vehicle and does not foreshadow any move to CEVA producing its own silicon for sale. “When our DSP is implemented [on a customer’s SoC] it is in a tiny silicon area… this [development chip] is large by comparison, it could never be a commercial proposition,” a spokesman commented. Positioning the platform, the company says that it will be available to prospective customers that will later integrate its IP on and SoC; it is not intended, and will not be available, for the wider “experimenter” market.
The highly integrated CEVA-TeakLite-4 DSP platform combines multiple sensing, processing and connectivity technologies enabling rapid system prototyping for mobile, wearable and smarthome SoC designs. The platform comes complete with drivers for all of the supplied peripherals.
Running at 500MHz, the power-optimised DSP provides designers with a powerful means to add ‘smart and connected’ capabilities to these devices, including always-on sensing, local processing and intelligence and connectivity. The platform also provides real-time power measurement that allows developers to optimise and power-tune their DSP software.
The CEVA Smart and Connected Development Platform incorporates the following elements:
· DSP development chip: 500MHz CEVA-TeakLite-4 and subsystem of integrated peripherals (TDM, DMA, I²C, I²S, ICU, Timers, GPIO, etc.)
· Host CPU: Linux running on-board ARM Cortex-A9 for complete CPU + DSP system prototyping
· Connectivity: multiple wireless technologies available from CEVA and its partners, including Bluetooth Smart and Smart Ready, Wi-Fi, ZigBee and GNSS
· Peripherals and interfaces: including on-board digital (MEMS) microphones, I²C interface for sensors, audio CODEC with digital and analogue audio in/outs, USB, UART, PCIe, and Ethernet ports, user configurable FPGA, GPIOs, DDR memory, SD card, and LCD display
· Arduino connectors and drivers: allows Arduino Shields to be connected to the board, leveraging a massive ecosystem of Arduino-related products
· CEVA’s Android Multimedia Framework (AMF) for offloading Android tasks from CPU to DSP to enhance always-on functionality and long audio playback time
· RTOS and DSP libraries: multi-tasking RTOS and a DSP library to jumpstart system design
CEVA has arrnged with partners to offer audio, voice and sensing software and applications that are fully optimised for the CEVA-TeakLite-4 DSP, including Sensory’s always-on voice activation and speech recognition, NXP Software’s multi-microphone noise reduction, Cypher’s neural-network based voice isolation technology, Cywee Motion sensor-fusion algorithms and more than 100 other software functions.
On November 19th 2015, CEVA will host a live webinar titled ‘Fast Track to Smarter IoT’ which will include an overview of the ‘smart and connected’ development platform. For more information and to register for the webinar, visit https://bit.ly/1NS2vQ9.