Marketed under the Easybond brand, the process is said to make it easier to delaminate plastic-based modules from the carrier surface after high-temperature processing (up to 500°C) without the need for Laser Lift-Off (LLO) processing.
Applications range from Low Temperature Polysilicon (LTPS) backplanes, touch panels, to flexible colour filters, all for flexible displays.
By applying Easybond directly on the mother glass before coating the base plastic layer, the OLED module can later be released with a low peel force under 5cN/cm that does not damage the structures atop.
By comparison, defects resulting from the current laser LLO process decrease OLED manufacturing yield to as low as 70%, hence Easybond’s MLO technology could enable panel makers to drastically improve their yield.
What’s more, Easybond does not require manufacturers to invest in new equipment nor in expensive and complicated laser lift off machines.
ARES Materials – www.aresmaterials.com