Tenstorrent signs Blue Cheetah for AI chiplet interconnect
AI chip designer Tenstorrent has licensed Blue Cheetah’s customisable die-to-die interconnect IP for its AI and RISC-V chiplet designs.
The deal to use the interconnect from Blue Cheetah aims to accelerate development of AI and RISC-V designs using chiplet technology..
Blue Cheetah currently provides its chiplet interconnect IP solutions in 4 nm, 5nm, 7nm, 12nm, and 16nm process technologies. Competitor Eliyan has just taped out chiplet interconnect PHJY on 3nm.
The customisable die-to-die interconnect can be used across a wide variety of end markets, achieving cost-effective scaling and greater reuse of IP on different manufacturing technologies..
The BlueLynx D2D interconnect subsystem IP provides physical (PHY) and link layer chiplet interfaces and supports both Open Compute Project (OCP) Bunch of Wires (BoW) as well as Universal Chiplet Interconnect Express (UCIe). BlueLynx connects to on-die buses/Networks-on-Chip (NoCs) with a wide variety of standards, including AMBA 4 CHI, AXI, ACE, and more. It is fully compliant with ODSA Transaction and Link Layer supporting AXI5 Lite (A5L), CHI rev D, virtual wires, and ECC
It provides 16Gbit/s/wire bandwidth with support down to 2Gbit/s/wire with under 2ns end-to-end latency and occupies less than 0.15 mm2 per 16bit data slice with a 45um to 130um bump pitch and up to 25mm trace lengths that can be used on organic substrates or silicon interposer packages. The energy consumption is under 0.5pJ/bit with an error rate of 1e-20.
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“Blue Cheetah is unique in its ability to provide customizable standards-based die-to-die interconnect solutions that support the full range of capabilities and process technologies we, our partners, and our customers need,” said Jim Keller, CEO of Tenstorrent. “Partnering with Blue Cheetah enables us to foster a chiplet-based ecosystem ready for both current and future system designs.”
“Tenstorrent delivers highly customized, high-performance AI and RISC-V chiplet solutions tailored to specific workloads and applications,” said Elad Alon, CEO of Blue Cheetah. “Customizable die-to-die interfaces are an essential component of these solutions and enable developers to create cost-effective multi-chip designs that deliver powerful performance and next-level energy efficiency.”
www.bcanalog.com; www.tenstorrent.com
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