MENU

Test interface boards for fine pitch requirements

New Products |
By eeNews Europe


The integration is a result of the Santa Clara board fab anticipating the market trend for chip scale packages, particularly for fine-pitch array packages such as BGAs or LGAs. The company is now able to build 0.3 mm through-hole constructions and boards with even higher layer count for high pin count, 0.4 mm fine pitch array applications.

Visit Multitest at www.multitest.com/pcb


Share:

Linked Articles
eeNews Europe
10s