Texas Instruments’ Lehi wafer fab starts production
LFAB, Texas Instruments’ 300mm wafer fab in Lehi, Utah, has started production a year after its acquisition from Micron Technology Inc.
LFAB is TI’s second 300mm wafer fab to start production in 2022 coming soon after RFAB2 in Richardson, Texas (see TI begins production at second Richardson wafer fab).
It brings the total of TI 300mm wafer fabs to three with others in planning.
The wafer fab in Lehi had been used for memory chip production and so had to be refreshed for use making analog and mixed-signal ICs.
“This achievement is part of our long-term capacity investments and further solidifies our commitment to expand internal manufacturing capacity to support the future growth of semiconductors in electronics,” said Kyle Flessner, senior vice president of technology and manufacturing, in a statement.
TI plans to spend between $3 billion and $4 billion in the fab, which has more than 275,000 square feet of clean room space. It currently supports 65nm and 45nm manufacturing process technologies with the option to go to more advance processes as required.
Related links and articles:
TI buys Micron’s Utah fab for $900m
TI begins production at second Richardson wafer fab
Texas Instruments stays on top of analog chip ranking
Texas Instruments closing two fabs, building one
TI to build up to four new 300mm fabs in Texas