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Thermal chassis simulator for passive cooling

Thermal chassis simulator for passive cooling

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By eeNews Europe



The unit contains both M3 and 4-40 hardware, as well as precision standoffs to support 0.600" or 1.000" clearance spreader solutions. Constructed from Blanchard-ground powder-cast plate aluminium, the surface flatness is better than 0.001" across the entire face. The anodizing gives the unit a basic emissivity of 0.75 or better, and represents the radiative area of an aluminium enclosure with 200sq.in. of surface area.

The CS-100 is also deployed as a development platform for proof of concept passive cooling systems. The extra hole-pairs around the perimeter are linked by a recessed groove on the back of the CS-100. In combination with nylon zip-ties, these hole-pairs make convenient strain-relief attachment points for the interface cables from your mounted PC/104 CPU. Keeping your cables neat and preventing undue harm to the connectors on the PC/104 motherboard, the CS-100 becomes the centerpiece of your passive prototyping experience.

Visit Advanced Digital Logic at www.adl-europe.com

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