Thermal compound enables tight spot heat dissipation
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By
eeNews Europe
Delivering thermal conductivity of 5.5 W/m-K and heat capacity of 1 J/g-K, TC50 is typically suitable for all bond lines over 0.15 mm thick. TC50 provides low thermal impedance at multiple gaps to permit the deployment of commonly used spreaders. It only requires low compressive force to deform under assembly pressure. As a result, any stress on components, solder joints and leads is minimised. The compound can be packaged in syringes or cartridges, or bulk packaged.
Chomerics – www.parker.com/chomerics
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